Test the Reliability of High Density Interconnect
High density interconnect is a technology used in PCBs to reduce the size of electronic circuit boards. This allows more components to be placed on a smaller area and allows the signals to travel more quickly. This increased speed is critical in many applications including consumer electronics, automotive and aerospace industries, medical devices, and telecommunications.
To achieve this, the manufacturers of HDI printed circuit boards use a variety of technologies to produce smaller components. These include advanced PCB materials and progressive fabrication processes such as plating-thru-hole for blind/buried vias or inkjet printing with silver nanoparticles. This allows for quicker signal transmission and improved device functioning. In addition to the higher efficiency, HDI PCBs also provide greater thermal security. This is achieved by layering copper unswervingly across the surface of the PCB, which creates ideal heat dissipation and demonstrates that an amplified component count will not compromise operational functioning under extreme operating conditions.
A key factor that drives the growth of high density interconnect technology is the increasing demand for miniaturized products. This is especially true in the consumer electronics industry where devices like smartphones, tablets, and wearables are increasingly complex. However, HDI techniques are also widely used in the medical and industrial fields where smaller, lightweight, and feature-rich devices are desired.
How Do You Test the Reliability of High Density Interconnect?
While the advantages of HDI technology are clear, the development process is time-consuming and expensive. The R&D design cycle durations, fabrication formula qualification expenses, and assembly optimization investments can all lead to inflated non-recurring engineering costs. However, the benefits of HDI technology – such as reduced weight, better manufacturability, and enhanced electrical performance beyond limitations of conventional approaches – can more than offset these initial investment costs.
As the HDI market continues to expand, it is important to know how to test the reliability of these circuits. A reliable test procedure for assessing the performance of a multilayer HDI board is to subject it to thermal shock testing. This is an essential step in ensuring that the board can withstand the high temperatures associated with reflow processing. The results from this test will help you determine the suitability of a specific manufacturing process for your project.
Thermal shock testing is done by subjecting the HDI circuit board to repeated cycles of high and low temperatures. This is done to simulate the real-world environment in which the circuit board will operate and assess its ability to withstand these stresses. The testing procedure involves passing the circuit board through a reflow oven for six times at different temperature settings. The results are then analyzed to identify any abnormalities in the performance of the circuit board.
There are a number of options to test the durability of a multilayer HDI circuit board. One option is to fabricate a sample and have it tested in a laboratory. This method can be cost-effective and fast, but it can be difficult to accurately evaluate the performance of a specific component in a small test sample. Another option is to test multiple samples of the same design and compare them to determine which offers the best results. This is often the most accurate way to determine which HDI circuit board will perform the best in your application.
